Electrical Test & Reliability Lab
A leading provider of qualification, design verification, reliability testing, and electrical testing services (including bare die, wafer, and package) for IDMs (Integrated Die Manufacturer) and OEMs (Original Equipment Manufacturer) in harsh environments such as military, aerospace, nuclear, automotive and medical, oil field industries.
Electrical & Reliability Testing
Electrical & Reliability Testing can be conducted at various stages of the manufacturing process, including the die, wafer, package, and module levels. Each of these stages has its own set of testing techniques and objectives based on the device datasheet and according to different standards such as MIL Std., JEDEC, AECQ, ESA Std, Nasa Std and specific customer requirements.
Electrical testing
Electrical testing Low, Medium and High Volume production capabilities
- Pre-series and production Wafer and Bare Dies Probe / EWS (Electronic Wafer sorting)
- 4 inches (100 mm), 6 inches (150 mm), 8 inches (200 mm)
- MPW (Multiple Project Wafer), Full Mask, Wafer scribed mounted on tape
- Up to 900 µm and down to 150 µm wafer thickness
- Bumped or unbumped wafer probe
- Multisite probing
- Digital Hi-End, Digital Hi pin count, mixed signal, RF and Power
- Parametric & functional tests for Digital, Mixed Signal and RF products
- Final Outgoing Inspection and PMI (Probe Mark Inspection)
- Temperature up to 200°C
- Wafer map inspection and full inkless process capability
- Pre-series and production Package Test
- From passive to complex integrated circuit (e.g. System In Package ) including power, RF and optical devices
- Device Up-screening and Up-rating
- Device upscreening and uprating involve testing components to ensure they meet higher reliability standards or can operate beyond their original specifications for demanding applications like aerospace and defense.
- Device programming (ESD sensitivity level : class 0)
- µController, flash, EEPROMS, EPROMS memories, GAL/PAL, FPGA, PLD/EPLD etc.
- ESD HBM and CDM (Electrostatic discharge), LU (Latch Up) and CMTI (Common Mode Transient Immunity) Test Services
- Drypack and Tape and Reel packing
Data Collection
Data Collection
- Data collection and statistical analysis tools for both Probe and Final Test results
- HW and SW maps
- Mapping per electrical test
- Composite Mapping
- Multi-site comparison
- On line SPC (Statistical Process Control) and outliers detection (PAT (Process Average Testing)
- GR&R and P/T Analysis
Endurance / Environmental Testing
Endurance / Environmental Testing
- Burn In and Lifetest static and dynamic bias for any kind of semiconductor technologies including wideband gap for power devices up to 300°C
- Memory Data retention test
- Temperature cycling -70°C to 150°C 10°C/mn with humidity capability 10% to 98% RH
- Extreme Temperature cycling -184°C to 315°C ramp from 0.01°C to 40°C/min
- Temperature shock Air Air -80°C to °220°C transition time less than 5s
- Temperature shock Liquid Liquid -80°C to °220°C transition time less than 5s
- Autoclave, THB 85°C/85%RH, HAST 130°C 10% to 98% RH
- IOL (Intermittent Operating Life)
- PTC (Power Temperature cycling)
- Damp Heat
- Constant Damp Heat: 30±2℃/93±3%, 30±2℃/85±3%, 40±2℃/93±3%, and 40±2℃/85±3%. Test time is 12h, 16h, 24h, and 48h
- Cyclic Damp Heat (12h+12hcycle): Commonly 40 ℃ and 55 ℃, the cycle is 1 day / time, and the number of cycles is 1, 2, 6...
- Thermal vacuum
- Temperature Range -55°C up to +125°C
- Pressure better than 10-5 mbar
- In situ test monitoring
- Salt Atmosphere
- Solder Reflow validation
Mechanical testing
Mechanical testing
- Constant acceleration 0 to 40 000 g
- Resonance Frequency Search (RFS)
- Sine and random vibrations
- Mechanical shock
- Half sine up to 2 000 g
- Shock Response Spectrum (SRS)
Design and Conception
Electronics Design and Manufacturing
- Electronic design
- Load Boards design and manufacturing
- Probe Cards (Cantilever or vertical probe technologies) design and manufacturing
- Burn-in Boards design and manufacturing
- THB and HAST Boards design and manufacturing
- ESD Test Fixtures design and manufacturing
- Test program development with full correlation and GR&R associated for program qualification
- Test qualification programs for reliability assessment (dynamic Burn In, LifeTest, IOL, PTC etc.)
- FPGA VHDL code
