Counterfeit
Alter Technology proposes different test coverage pending your budget and lead-time expectations.
Semiconductor Counterfeit
Detect Counterfeit EEE Parts
Detect Counterfeit semiconductor components
Semiconductor counterfeit detection is the process of identifying and preventing counterfeit or unauthorized semiconductor components from entering the supply chain based on the IDEA-STD-1010B, AS6081 and custom specification.
test sequence
Alter Technology proposes different test sequence pending your budget and lead-time expectations
Alter Technology proposes different test coverage pending your budget and lead-time expectations.
- Packaging and label inspections – Non destructive test
- External visual inspections – Non destructive test
- Quantity checking – Non destructive test
- Kitting to implement test by sampling – Non destructive test
- Physical dimension – Non destructive test
- Marking permanency & scrape test – Destructive test (sample used for package opening)
- XRAY – Non destructive test
- Acoustic Tomography – Non destructive test
- Lead finish identification (XRF) – Non destructive test
- Possibility to implement µsection to confirm delamination – Non destructive test
- Electrical test (test coverage pending available lead-time) – Non destructive test
- Solderability test (Dip & look and wetting balance excepted for BGA: report simulation) – Destructive test
- Package opening and internal die inspection – Destructive test
- Bond strenght and die shear – Destructive test
Parts storage associated with customized software to manage / record traceability, labelling and storage location:
- Dedicated storage area (with dry cabinets <5%RH) for plastic package
- Protection against ESD risk during part handling
- Delivery with Moisture Barriers Bags (MBB) – dry pack
